翻訳と辞書
Words near each other
・ Ball detent
・ Ball Diamond
・ Ball differential
・ Ball Don't Lie
・ Ball dress
・ Ball Fighter
・ Ball flower
・ Ball Four
・ Ball Four (TV series)
・ Ball game
・ Ball gauge
・ Ball Glacier
・ Ball Glacier (James Ross Island)
・ Ball Glacier (Victoria Land)
・ Ball gown
Ball grid array
・ Ball Ground, Georgia
・ Ball Haye Green
・ Ball head
・ Ball High School
・ Ball Hill
・ Ball Hill, Dorset
・ Ball hockey
・ Ball Hockey World Championship
・ Ball hog
・ Ball im Savoy
・ Ball in and out of play
・ Ball J
・ Ball Jacks
・ Ball joint


Dictionary Lists
翻訳と辞書 辞書検索 [ 開発暫定版 ]
スポンサード リンク

Ball grid array : ウィキペディア英語版
Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.
== Description ==

The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny ball of solder stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux.〔(Soldering 101 - A Basic Overview )〕 The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
ウィキペディアで「Ball grid array」の詳細全文を読む



スポンサード リンク
翻訳と辞書 : 翻訳のためのインターネットリソース

Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.